Standard BGA-Pad Heatsinks
A number of mounting options are available, including pre-applied interface tape, spring clips, and push pins. The standard line of heat sinks is available for BGA pad and similar packaged devices. BGA heat sinks are usually crosscut to convert the extruded fins into pins which allow them to be used in more diverse applications. MAGNTEK is an outstanding BGA heatsink manufacturer, we always dedicate ourselves to provide high-quality BGA pad for our customers.
45 x 45 x 10 mm BGA Heatsink
Width[mm] 45
Height[mm] 10
Length[mm] 45
35 x 35 x 10 mm BGA Heatsink
Width[mm] 35
Height[mm] 10
Length[mm] 35
30 x 30 x 10 mm BGA Heatsink
Width[mm] 30
Height[mm] 10
Length[mm] 30
28 x 28 x 25 mm BGA Heatsink
Width[mm] 28
Height[mm] 25
Length[mm] 28
28 x 28 x 15 mm BGA Heatsink
Width[mm] 28
Height[mm] 15
Length[mm] 28
28 x 28 x 11 mm BGA Heatsink
Width[mm] 28
Height[mm] 11
Length[mm] 28
28 x 28 x 8 mm BGA Heatsink
Width[mm] 28
Height[mm] 8
Length[mm] 28
25 x 25 x 10 mm BGA Heatsink
Width[mm] 25
Height[mm] 10
Length[mm] 25
21 x 21 x 15 mm BGA Heatsink
Width[mm] 21
Height[mm] 15
Length[mm] 21