DESCRIPTION

Aluminum extruded 6063-T5 Cooler and high aspect ratio aluminum heatsink extrusion
Aluminum extrusions BGA heat sinks for electronic device and the PCB
Heat sinks are designed for common package sizes like T0220, T0247, and D2pak
Stamped heat sink can have features that clip on to the device so that a screw or secondary clip is not required
Aluminum stampings are anodized for improved performance in natural convection
BGA heat sinks are usually crosscut to convert the extruded fins into pins which allow them to be used in more diverse applications
The heat sinks can be either attached to the device or to the PCB depending upon the application and the mechanical requirements
Board Level heat sinks are so named because they are generally attached both to the device and the PCB
Pushpins are another common attachment method and require two small holes in the PCB
The push pin can be made from plastic or metal, uses the energy of a small spring to provide enough force to keep the heat sink in place
Black Anodized, Powder coating and Chromate with RoHS-compliant Quality
ISO 9001 Certificate
Red Anodized with RoHS-compliant Quality
ISO 9001 Certificate