DESCRIPTION

BGA heat sinks can also be attached with thermal adhesive tape, push pins, or epoxy.
CHOMERICS T725 / 3M9448B pad / SEKISUI # 5760 / TM-100B thermal adhesive tape assembled.
Tape mounting saves board space by eliminating mounting holes.

Aluminum stampings are anodized for improved performance in natural convection.
Clip and heat sink can be attached within a few seconds.
Heat sink can be easily removed within seconds and reapplied.
Reliable mechanical attach mechanism ensures that heat sink will stay on over the life of the product.
Designed specifically for BGAs and other surface mount packages.

Pin Fin array allows omni-directional airflow to maximize heat dissipation.
Offers a custom design service to meet all your cooling requirements.

RoHS-compliant Quality.
ISO 9001 Certificate.

DIMENSIONS

Dimension Download